Gwent Group
Advanced Materials systems

Overview of the range of our Products

Section

Description

Carbon Graphene Pastes
Carbon Based Pastes for Electrochemistry
Carbon Mediated Pastes for Electrochemistry
Other Carbon Based Systems
Silver/Silver Chloride Pastes for Electrochemistry
Silver Based Low Temperature Systems
Silver Based Firing Systems
Gold Based High Temperature Cure Systems
Platinum Based Low Temperature Cure Systems
Platinum Based Firing Systems
Alloy Based Firing Systems
Aluminium Based Firing System
High Brightness Phosphor Pastes
Insulating Low Temperature Based Systems
Dielectric Low Temperature Based Systems
UV Curable Products
Binder Low Temperature Systems

Carbon Graphene Paste

Section 1

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq @ 25µm

Curing

Temperature degree C

Properties
34-35
5.5-7.5

<7.5

130
Low electrical resistance designed as a screen printable conductive paste.

Carbon Based Pastes for Electrochemistry

Section 2

       

Paste

Number

Solids

Content %

Viscosity

Pa.s.

Resistivity

Ohm/sq @ 25µm

Curing

Temperature degree C

Properties
39-41
2.7-3.3

<50

60-80
Designed for WE, the paste can be used in conjunction with UV dielectrics and offers good line definition and fast drying advantages.
39-43
3.1-5.8
<75
60-130
Designed for WE that give excellent electrochemical performance with good reversibility when using cyclic voltammetry.
39-43
2.0-5.8
<75
60-130
Designed for WE. This is low viscosity version of C2030519P4.
39-43
2.5-4.0
<75
60-130
Designed for WE. This is low viscosity version of C2030519P4
41-42.5
4.0-8.0

≤137

130
Designed for WE and offers very good definition on printing. Low CV%.

Carbon Mediated Pastes for Electrochemistry

Section 3

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq @ 25µm

Curing

Temperature degree C

Properties
42-43
2.5-4.5
48.7
60-80
Prussian Blue graphite mediated carbon paste designed for WE.

Other Carbon Based Systems

Section 4

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq @ 25µm

Curing

Temperature degree C

Properties
34-38
5.5-10.0

<10

130
Screen printable highly conductive paste for use in a variety of applications; gives a tough, physically resistant printed film, good flexibility and adhesion.
30-33
8.0-10.0
n/a
150

Thermoplastic paste designed to burn out completely during firing to leave a void of specific shape and dimension. No need to be stored in a freezer or refrigerator.

Silver/Silver Chloride Pastes for Electrochemistry

Section 5

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq @ 25µm

Curing

Temperature degree C

Properties
81.14-83.14
3.5-7.0
≤5
60-80
Silver:Silver Chloride 40:60
81.14-83.14
3.5-7.0
600m
60-80
Silver:Silver Chloride 50:50
81.14-83.14
3.5-7.0
<150m
60-130
Silver:Silver Chloride 50:50
80.8-82.8
2.0-5.5
<100m
60-80

Silver:Silver Chloride 60:40. High conductivity. Low curing temperature.

81.14-83.14
3.5-7.0
<3
60-80
Silver:Silver Chloride Paste 60:40
81.14-83.14
3.5-7.0
≤5
60-80
Silver:Silver Chloride Paste 60:40
81.14-83.14
2.0-5.0
<40m
60-80
Silver:Silver Chloride Paste 80:20
76.5-78.5
5.0-9.0

200m

60-80
Silver:Silver Chloride 90:10, specifically designed to give good adhesion to ceramic substrates.

Silver Based Low Temperature Systems

Section 6

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq @ 25µm

Curing

Temperature degree C

Properties

Silver content 40%

10-13cPs

@ 25ºC

Volume Resistivity

5-30uΩ.cm

150-250

Nanosilver for inkjet printing (solvent based system) which demonstrates superior conductivity onto a variety of substrates.

64.5-65.5
3.0-5.0
15-25m
130-170
Thermoplastic paste suitable for CE and conductive tracks. This material has excellent adhesion properties (tougher film) with faster evaporating solvents and exhibits good conductivity.
44.7-45.25
0.72-1.78

Volume Resistivity @ 60ºC - 925.68 Ω.cm

@130ºC - 527.45 Ω.cm

130-170
Thermoplastic paste with low silver content presenting low resistivity, good flexibility and adhesion on certain substrates.
55.69—57.69
7.0-10.0
0.025-0.08
150
Flexible silver paste for use in electro luminescent systems.

Silver Based Firing Systems

Section 7

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq

Firing Temperature degree C

Properties
75.2-76.3
11.0-18.0
Volume Resistivity @600ºC - 3.4 x 10ˉ6 Ω.cm
550-625
Lead free Silver top coat paste.
69-71
8.0-12.0
≤20m
550-625
Lead free designed as a top coast for Silver Zinc Paste C2140618D2 printed on PTC ceramics.
9.0-18.0

≤ 0.3

Related to the properties of the ceramic.
Lead free designed as the base layer for coating Barium Titanate PTC ceramics
70-73
7.5-9.5
3m
700-800
Lead free termination paste for single layer PZT ceramics.
76-77
18.0-25.0
n/a
800-850
Silver Platimum Paste 80:20, suitable for electro-ceramic substrates and wire bonding.
C71217D3
        Silver Paste.

Gold Based Low Temperature Cure Systems

Section 8

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing

Temperature degree C

Properties
C2041206P2 80-83 12-18 110 at 27µm 60-180 Screen printable gold polymer paste for applications in electrochemical sensors.

Gold Based High Temperature Firing Systems

Section 9

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq

Firing Temperature degree C

Properties
80-82
56.0-62.0
<4m
700
Screen printing gold paste designed for high printing definition electrodes in sensor applications.

Platinum Based Low Temperature Systems

Section 10

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq

Curing

Temperature degree C

Properties
83-87
14.0-22.0
0.59
80-130
Polymeric platinum paste designed for printing WE, curing on polymer substrates.
85.5-86.5
10.0-15.0
0.32
130-180
Designed for printing WE. Excellent chemical and environmental resistance. Suitable for fine line printing.

Platinum Based Firing Systems

Section 11

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq

Firing Temperature degree C

Properties
73.75-74.24
6.0-3.5
<0.1
1150-1250

Platinum paste suitable for firing applications on electro-ceramic substrates. Stable electrical properties on repeat firing.

69.25-70.25
9.1-18.8
60m
850
Low shrinkage, high adhesion to ceramic subtrates.
78.9-79.1 0.13-2.58

~ 30m

1000-1300
Designed for oxygen sensor applications, this is a pure platinum paste with no inorganic additions. Good response to oxygen.
73.5-74.5 51.0-61.0
320m
780-800
Firable Platinum paste designed for printing WE on ceramic substrates.
C1990106P1
        Platinum Electrode Paste (81% Pt).

Alloy Based Firing Systems

Section 12

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Firing Temperature degree C

Properties
9.0-18.0

≤ 0.3

Related to the properties of the ceramic.
Lead free designed as the base layer for coating Barium Titanate PTC ceramics

Aluminium Based Firing Systems

Section 13

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Firing Temperature degree C

Properties
68-72
11-18
n/a
780-910
Designed particularly good with large volumes of PTC components are being processed in belt furnaces conditions, where improved stain resistance and good visual appearance are required.

High Brightness Phosphor Pastes

Section 14

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Lamp Color

Curing

Temperature degree C

Properties
79-82
1.5-2.5
Green
130
Heat curable paste, excellent adhesion onto ITO, chemical and environmental resistance - produces green lamp.
80-82.5
0.86-2.50
Blue
130
Heat curable paste, excellent adhesion onto ITO, chemical and environmental resistance - produces blue lamp.
75-83
0.71-2.15
Blue/Green
130
Heat curable paste, excellent adhesion onto ITO, chemical and environmental resistance - produces blue/green lamp.
78.5-82.5
0.86-2.50
Orange
130
Heat curable paste, excellent adhesion onto ITO, chemical and environmental resistance - produces orange lamp.
82.5-84.5
0.86-4.50
White

130

Heat curable paste that , excellent adhesion onto ITO, chemical and environmental resistance - produces white lamp.
77.5-81.5
0.86-2.5

Blue/Green & Blue

130
When use in conjunction with D2090130P5 dielectric paste (pink) it produces white lamp.

Insulating Low Temperature Based Systems

Section 15

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing

Temperature

Properties
51.5-54.5
12.0-16.0
n/a
80-130
Grey coloured screen printable polymer insulation paste suitable for defining electrode areas, designed for maximum flexibility.
D2180411D5
        Insulator Ink.

Dielectric Low Temperature Based Systems

Section 16

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq

Curing

Temperature degree C

Properties
79.5-81
10-14
n/a
130
White dielectric paste for electrochemical sensors, excellent opacity, insulation and long screen life.
56-61
9.0-13.0
n/a
130
White dielectric paste for electrochemical sensors, excellent opacity, insulation and long screen life.
47.4-49.4
14.0-22.0
n/a
80-130
Polymer dielectric designed for defining electrode areas and forms a protective layer over the electrode tracking during immersion of the electrode.
73.5-76.5
1.4-3.2
n/a
130
Thermoset white dielectric heat curable paste for EL systems that has high dielectric constant which leads to a high light output.
72.5-76.5
1.2-3.0
n/a
130
Thermoset pink dielectric heat curable paste for EL systems, designed to be used with Phosphor Paste C2080211P2 to produce white lamp.

UV Curable Products

Section 17

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Cured

thickness

Typical

curing

conditions

Properties
95-98
1.5-2.5

Typically

8-10µ

Cure in a UV conveyor curer. An UV dose of 450mJ/cm2 is necessary to cure.

UV Clear Dielectric Paste, designed for screen-printing on polymer films and for overprinting printed products. This materials is scratch resistant, has long screen time and offers good adhesion to UV, solvent and water-based inks.

Binder Low Temperature Systems

Section 18

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing

Temperature degree C

Properties
37.5-40.0
0.30-0.50
n/a
130
Binder for phosphor inks, as part of a range of Heat Curable Inks for EL systems.
36.0-39.0
0.33-0.15
n/a
130
Resin binder designed for EL systems.

Please contact us for these new products by using our Online Form or email direct to

GBPP-Sales@sunchemical.com